我们的半导体解决方案分部业务生产和销售的装配和包装设备，微电子，半导体，光电子，光电子等行业的广泛线。它提供了一个不同的产品范围从结合到模制和饰件及形式将这些活动的整合成完整的在线系统。
该集团已成功跻身于后端装配的主力队员和包装市场，其创新的解决方案，并不断专注于为客户创造价值。2002年，一群流离失所常年行业的领导者，成为头号在组装和包装设备行业。自那时以来，一直保持了与2012年例外领先。
Under the Semiconductor Solutions Segment Business, the Group has introduced several examples of technology innovation like the world’s first gold wire bonder with 50µm pad pitch capability, AB339, the industry's first production machine capable of 35µm ultra-fine pitch bonding (Eagle 60 wire bonder) and the TCB (Thermal Compression Bonding) Bonder with breakthrough in fine pitch high I/O flip chip bonding which have helped to transform and contribute to the high quality of life enjoyed by people around the world.
